TSD Series Thermal Shock Chamber (Three-Zone)
The TSD Series Thermal Shock Chambers feature a three-zone design, with separate high-temperature, low-temperature, and test zones. Unlike basket-transfer systems, the TSD chambers keep the test specimen completely stationary, switching airflows between hot and cold zones via an internal damper mechanism. This prevents mechanical stress or positional disturbance to delicate components, making it ideal for electronic parts, miniature assemblies, and sensitive materials during environmental simulation, reliability test, and stress screening.
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Three-zone configuration for precise and efficient thermal shock test. -
Stationary specimen design minimizes mechanical influence during test.
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Rapid temperature change via airflow switching (no specimen movement).
Chamber Volume (L): Approx. 80 / 150 / 252 / 364 / 504 / 1000
Temperature Fluctuation (°C): ≤ ±1°C (no load)
Temperature Uniformity (°C): ≤ ±2°C (no load)
Temperature Deviation (°C): ±2°C (no load)
Thermal Shock Range (°C): -40 / -55 / -60 to +150°C
Load Capacity: 5–50 kg aluminum blocks
Exposure Time: 30 minutes
Recovery Time: ≤ 5 minutes
Transfer Time: (airflow switching) ≤ 15 seconds
High-Temperature Chamber Range (°C): +60°C to +200°C
Heating Time (Ambient to +200°C): ≤ 60 minutes
Low-Temperature Chamber Precooling Specifications
Model Precooling Range (°C) Cooling Time (Ambient to Target Temp)
TSD4** -70°C to 0°C ≤ 60 min to reach -55°C
TSD5** -70°C to 0°C ≤ 60 min to reach -65°C
