Integrated Circuit
The laboratory is equipped with advanced testing and analysis devices, including Ultra-high resolution digital microscope (3D Optical Microscopy), Scanning Acoustic Tomography,Ultra-high resolution (3D X-ray analysis),High-Resolution Current-Voltage Testing Instruments, Nano-probe, Conductive Atomic Force Microscopy (C-AFM), Failure Site Localization, High-Resolution Electron Microscopes (TEM, SEM, DB-FIB), functional and reliability test instruments, as well as equipment for Electrostatic Discharge Immunity and Compatibility Analysis. These devices comprehensively cover the testing requirements for integrated circuits.
Failure Analysis: Non-Destructive Testing, Electrical testing, Failure site localization, Destructive physical analysis,Advanced process DPA verification and analysis, Engineering sample packaging services,Chip structure and composition analysis, etc.
Material Analysis: Focused Ion Beam Circuit Edit,Microstructural Characterization, Crystallographic Analysis, Elemental Analysis, Spectroscopic Energy Analyzer,Failure Analysis of Samples / Defect and Root Cause Analysis,etc.
Reliability Test：Board Level/Solder Joint Reliability, Operating Life Test Verification,Design and Packaging Reliability Verification, Circuit design, layout, and debugging etc.
Function Test: Dynamic and static parameter testing of power devices, Chip performance testing, etc.
Analog chips, logic chips, microprocessors, memory chips.
![pohuaixingwulifenxi[1].jpg](https://chinasticom-guanwang.oss-cn-hangzhou.aliyuncs.com/Public/Uploads/uploadfile2/images/20250618/pohuaixingwulifenxi[1].jpg)
