TSM Series Thermal Shock Chamber (Two-Zone)
The TSM Series Thermal Shock Chamber (Two-Zone) feature two separate chambers—one for high temperature and one for low temperature. A movable basket transfers the specimen between these two zones, enabling rapid temperature changes to simulate thermal shock conditions. These chambers are widely used for environmental simulation, reliability test, and stress screening of complete systems, components, subassemblies, and materials, especially in electrical and electronic industries.
-
Basket-type specimen transfer for ultra-fast temperature transition. -
Compact design with efficient internal layout.
-
Excellent temperature uniformity within the test chamber.
Test Chamber Volume(L): 486 / 1243
Temperature Fluctuation (°C): ≤ ±1°C (no load)
Temperature Uniformity (°C): ≤ ±2°C (no load)
Temperature Deviation (°C): ±2°C (no load)
Thermal Shock Range (°C): -40 / -55 / -65 to +150°C
Load Capacity: 5–40 kg aluminum block
Exposure Time: 30 minutes
Recovery Time: ≤ 5 minutes
Transfer Time: ≤ 15 seconds
High-Temperature Chamber Preheat Range: +60°C to +200°C
Heating Time (Ambient to +200°C): ≤ 60 minutes
Low-Temperature Chamber (Precooling Specifications)
Model Precooling Range Cooling Time (Ambient to Target Temp)
TSM4** -70°C to 0°C ≤ 60 min to reach -55°C
TSM5** -70°C to 0°C ≤ 60 min to reach -65°C
TSM6** -80°C to 0°C ≤ 60 min to reach -70°C
