Destructive Physical Analysis
Destructive Physical Analysis is conducted to verify whether the design, structure, materials, and manufacturing quality of components meet specification requirements. This includes both non-destructive and destructive inspections and analyses on production lots to obtain information on the overall quality of the components.
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Physical Failure Analysis (PFA) for root cause determination typically involves two major parts: sample preparation and observation.
Sample preparation includes:
Decapsulation (Decap): Removal of encapsulant material、 Delayering: Layer-by-layer removal of chip materials、 Pre-processing: Structural removal, cold mounting, cross-section cutting, or de-soldering for sampling、Cross-section / Backside Grinding、 Cross-section Preparation with Focused Ion Beam (FIB CP or Ion Milling)
Observation and analysis techniques include:
Scanning Electron Microscopy (SEM)、 Energy Dispersive X-ray Spectroscopy (EDX or EDS)、 Electron Backscatter Diffraction (EBSD)
