Board Level/Solder Joint Reliability Verification
Board-level (solder joint) reliability verification is a test based on mechanical and thermal factors, primarily including but not limited to thermal cycling, shock, bending, constant acceleration, solderability, etc. It aims to determine the functional reliability of the product after exposure to mechanical and thermal environmental conditions and evaluate the integrity of its structure. Through specially designed (Daisy chain) board-level samples, the testing process can be monitored in real time, and the final results can be statistically analyzed using Weibull analysis.
The lab is equipped with advanced facilities, including a controllable single-chamber temperature cycling test system, high-precision universal testing system, high/low g shock test systems, centrifugal accelerators, solderability testing equipment, and SMT assembly lines. These enable mechanical environment tests such as bending, shock, and constant acceleration, as well as thermal cycling, solder joint wetting environment evaluation, and board-level soldering.
Additionally, the lab features a multi-channel signal acquisition system capable of collecting data on acceleration, strain/stress, and other parameters. With computational simulation and analysis capabilities, the team can assist clients in data analysis, failure investigation, and corrective actions.
Electrical and electronic products, automotive products, packaging and transport items, rail transit equipment, aerospace devices, nuclear equipment, marine equipment, etc.
