Design and Packaging Reliability Verification
Packaging reliability refers to the systematic investigation, analysis, and evaluation of the performance stability of integrated circuit packaging by applying electrical stress, thermal stress, mechanical stress, or a combination of these stresses. The purpose is to examine the performance of the packaging structure and materials under harsh stress conditions, thereby determining whether the reliability of the packaging product meets the standards, whether the design is reasonable, and whether the manufacturing process is normal.
Multi-specification ovens and temperature and humidity chambers, controllable single-chamber temperature cycle testing machine, three-chamber gaseous temperature shock testing machine, liquid temperature shock testing machine, high-acceleration stress testing machine, reflow soldering testing machine, and 3D profile tester equipped with package size measurement, flatness and coplanarity can meet all specifications for package reliability testing.
Temperature cycling test, high-temperature storage test, low-temperature storage test, temperature and humidity test, highly accelerated stress test, reflow soldering test, liquid temperature shock test, and physical dimension test.
