Reliability Verification of Automotive Integrated Circuits
Reliability validation of automotive components (AEC), board level reliability (BLR), vehicle electrical reliability validation, vehicle scale group/PCB reliability validation. The testing projects include: accelerated environmental stress testing, accelerated life simulation testing, packaging assembly integrity testing, wafer manufacturing reliability testing, electrical characteristic confirmation testing, defect screening and monitoring testing, cavity device integrity testing, and specialized testing for multi-chip modules, among other validation projects.
Test group A-Accelerated environment stress tests, is equipped with a multi-specification oven and temperature and humidity chamber, a linear controllable single-chamber temperature cycle testing machine, an uncontrollable three-chamber rapid temperature change testing machine, a liquid temperature shock testing machine, a high-acceleration stress testing machine, and a reflow soldering testing machine, which can meet the stress tests in different environments.
Test group B-accelerated lifttime simulation tests-According to the product, it is divided into low power consumption, medium power consumption, high power consumption and other types, using special life test equipment, heating the chip through equipment, fixture (socket) or special device, and the equipment driver board generates signal excitation and power supply realizes the chip working state through the aging board (BIB) and fixture. It can provide monitoring methods such as temperature, voltage, current, signal output and so on to ensure that the chip test is carried out correctly. The long-term life and performance of a product can be evaluated in an effective (shorter) period by applying thermal and electrical stresses to accelerate the aging process of a product through accelerated life testing.
Test group C-Package assembly integrity tests, Equipped with chip push-pull force testing machines, thrust tests for solder balls, wire pull and shear tests, and solderability tests, as well as a 3D contour tester for measuring package dimensions and flatness, we can meet all automotive specifications for package integrity testing.
Test group E-electrical verification tests Equipped with an ultrafast ESD and latch-up test system, it provides advanced capabilities for testing high-pin-counting devices to today's Human Body Model (HBM) and Machine Model (MM) ESD standards. Charging Equipment Model (CDM) testers to test the potentially damaging effects of ESD in order to identify and harden sensitive structures prior to full-scale production, and test instruments for EMC radiated emissions and radiated immunity testing.
Test group G-cavity package integrity tests The board-level reliability testing (BLR) is equipped with controllable single-chamber temperature cycling testers, high-precision universal testing machines, heavy/lightweight impact testing systems, centrifuge accelerometers, and bath-type solderability testing machines for surface mount production lines, among other equipment. It can provide mechanical environment tests such as bending, impact, and constant acceleration, as well as high and low temperature cycling and solder joint wetting environments, and soldering onto boards. Additionally, it is equipped with a multi-channel signal acquisition system to meet the multi-channel acceleration, strain, and stress signal collection needs and possesses computational simulation analysis capabilities to assist clients in data analysis and failure rectification work.
