Advanced Process DPA Verification and Analysis
Destructive Physical Analysis (DPA) is a quality verification method in which representative samples are randomly selected from a batch of finished electronic components. A series of non-destructive and destructive physical tests and analyses are performed to evaluate whether the design, structure, materials, and manufacturing processes meet the specifications and intended use requirements.
![xianjingongyiDPAyanzhengfenxi[1].jpg](https://chinasticom-guanwang.oss-cn-hangzhou.aliyuncs.com/Public/Uploads/uploadfile2/images/20250618/xianjingongyiDPAyanzhengfenxi[1].jpg)
Non-Destructive Analysis:
Evaluation of sample integrity without causing damage, using various instruments to assess the component’s condition. Includes: Visual inspection、X-ray inspection for internal structural analysis、Scanning Acoustic Tomography (SAT) for ultrasonic inspection.
Destructive Analysis:
Examination of surface or cross-sectional structures through physical removal or cutting, using instruments to assess internal conditions. Includes: Die inspection after decapsulation、Examination of metal interconnects、Assessment of metal formation processes.
Abnormality Analysis:
Structural or compositional analysis focused on defective or suspicious areas. Includes:
Defect parameter measurement、Delamination and cross-sectional failure analysis、Deterioration or contamination of metallic materials、Foreign material/component composition analysis
