Engineering Sample Packaging Services
Wafer dicing is performed to separate individual dies from the wafer, serving as a preparatory step for rapid packaging. Rapid packaging is a flexible, small-volume packaging service that enables faster electrical analysis and testing. It helps customers meet the demands of high variation and high-standard markets by shortening development and verification cycles.
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Test Items
Wafer Dicing、Die Wire Bonding / Packaging、Rebonding (Wire re-bonding)、Reball (Solder ball reattachment)
