Chip Structure/Composition Analysis
Chip Structure and Material Composition Analysis involves the deconstruction of finished products to reveal internal structures and manufacturing process information. This includes details such as external package type, interconnect methods and materials, chip appearance, and key internal structural dimensions. Through such reverse engineering techniques, clients can gain insights into the design and manufacturing practices of other manufacturers, supporting feasibility studies, design brainstorming, issue identification, and cost analysis.
![xinpianjiegoufenxichengfenfenxi[1].jpg](https://chinasticom-guanwang.oss-cn-hangzhou.aliyuncs.com/Public/Uploads/uploadfile2/images/20250618/xinpianjiegoufenxichengfenfenxi[1].jpg)
Test Items
Chip packaging analysis、Internal chip structure analysis、Package dimension measurement、BGA substrate circuit layout and layer count analysis.
